1. Features
·SAW filter for GPS.
·High stability and reliability with good performance and no
adjustment.
·Narrow and sharp pass band characteristics.
·Low insertion loss and deep stop band attenuation for
interference.
·Low – loss SAW filter for GPS.
2. ELECTRICAL SPECIFICATION
| Items | Conditions |
| Operation temperature rang | -30℃ ~ +85℃ |
| Storage temperature rang | -40℃ ~ +85℃ |
ESD voltage Sensitive discharge device | ESD(MM) : 50VDC ESD(HBM) : 175VDC |
| DC Voltage VDC | 5V |
| Max Input Power | 15dBm 2000h |
| Moisture Sensitivity Level | MSL 2 |
2-1.Electrical characteristics
AT 25℃±5℃
| Items | Test Condition | Min | Typ | Max | Unit |
| Center Frequency | - | - | 1575.42 | - | MHz |
| Insertion Loss | F0±1.2 MHz | - | 0.9 | 1.3 | dB |
| Ripple Level | F0±1.2 MHz | - | 0.1 | 0.5 | dB |
| Attenuation | D.C~1425MHz | 30 | 35 | - | dB |
| 1425~1500MHz | 38 | 42 | - | dB |
| 1500~1525MHz | 42 | 47 | | |
| 1625~1650MHz | 40 | 43 | - | dB |
| 1650~1725MHz | 35 | 38 | | |
| 1725~1850MHz | 35 | 38 | - | dB |
| 1850~2000MHz | 30 | 35 | - | dB |
| 2000~3000MHz | 30 | 35 | - | dB |
| VSWR | 1574.22~1576.62MHz | - | 1.2 | 1.6 | - |
| Input/Output Impedance | - | - | 50 | - | ohm |
2-2.Typical frequency response
5. ENVIRONMENTAL CHARACTERISTICS
5-1 High temperature exposure
Subject the device to +85℃ for 16 hours. Then release the filter
into the room conditions
for 24 hours prior to the measurement. It shall fulfill the
specifications in 2-2.
5-2 Low temperature exposure
Subject the device to -40℃ for 16 hours. Then release the device
into the room conditions
for 24 hours prior to the measurement. It shall fulfill the
specifications in 2-2.
5-3 Temperature cycling
Subject the device to a low temperature of -40℃ for 30 minutes.
Following by a high
temperature of +85℃ for 30 Minutes. Then release the device into
the room conditions
for 24 hours prior to the measurement. It shall meet the
specifications in 2-2.
5-4 Resistance to solder heat
1,immerge the solder bath at 260℃ for 10 sec
2,the iron at 370℃ for 3 sec)
5-5 Solderability )
Submerge the device terminals into the solder bath at 245℃ ±5℃ for
5s, More than
95% area of the soldering pad must be covered with new solder. It
shall meet the
specifications in 2-2
5-6 Reflow soldering
The specimen shall be passed through the reflow furnace with the
condition shown in
the above profile for 1 time.
The specimen shall be stored at standard atmospheric conditions for
1h, after which
the measurement shall be made. Test board shall be 1.6 mm thick.
Base material shall be
glass fabric base epoxy resin.
5-7 Mechanical shock
Drop the device randomly onto the concrete floor from the height of
1m 3 times. the device
shall fulfill the specifications in 2-2.
5-8 Vibration
Subject the device to the vibration for 1 hour each in x,y and z
axes with the amplitude of
1.5 mm at 10 to 55 Hz. The device shall fulfill the specifications
in 2-2.
6. REMARK
6.1 Static voltage
Static voltage between signal load & ground may cause deterioration
&destruction of
the component. Please avoid static voltage.
6.2 Ultrasonic cleaning
Ultrasonic vibration may cause deterioration & destruction of the
component. Please
avoid ultrasonic cleaning
6.3 Soldering
Only leads of component may be solded. Please avoid soldering
another part of
component.
7. Packing
7.1 Dimensions
(1) Carrier Tape: Figure 1
(2) Reel: Figure 2
(3) The product shall be packed properly not to be damaged during
transportation and storage.
7.2 Reeling Quantity
3000 pcs/reel φ 178mm
10000 pcs/reel φ 259mm
7.3 Taping Structure
(1) The tape shall be wound around the reel in the direction shown
below.
(2) Label
| Device Name | |
| Marking | |
| User Product Name | |
| Quantity | |
| Lot No. | |
(3) Leader part and vacant position specifications.
